Methodology for modeling steady state thermal behavior of current-carrying systems of electrical and electronic apparatus
DOI:
https://doi.org/10.15588/1607-6761-2025-4-1Keywords:
current-carrying system, thermal behavior, current-carrying component, heating, temperature-rise, heat flowAbstract
Purpose. Develop a procedure for constructing models of the stationary thermal behavior of current-carrying systems of electrical and power electronic apparatus.
Methodology. The development of the procedure was carried out using methods of analysis and synthesis of current-carrying systems of apparatus, as well as classical methods to solve differential equations.
Findings. Structural analysis of the current-carrying systems of real electrical and power electronic apparatus has shown that they contain a certain set of typical current-carrying components, namely, conductors of invariable cross-sectional area (rods of a certain length or semi-infinite ones); contacts of various types, power semiconductor devices. These components have a certain mathematical model that establishes their boundary parameters: temperatures and heat flows in a stationary thermal behavior. Using the property of temperature field continuity, it is possible to construct a mathematical model of a current-carrying system of a rather complex structure, which contains the foregoing current-carrying components.
Originality. A methodology has been developed for constructing mathematical models of the stationary thermal behavior of current-carrying systems of apparatus that contain various current-carrying components: conductors, contacts, and power semiconductor devices.
Practical value. The proposed methodology enables us to construct a mathematical model of the current-carrying system of the apparatus, which, in turn, makes it possible to determine its stationary thermal behavior with consideration of the system configuration.
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